Program Committee

 

Jiliang Zhang, Hunan University

Aibin Yan, Hefei University of Technology

Stefan Holst, Kyushu Institute of Technology

Michiko Inoue, Nara Institute of Science and Technology

Hao-Chiao Hong, National Yang Ming Chiao Tung University

Xiaoqing Wen, Kyushu Institute of Technology

Hideyuki Ichihara, Hiroshima City University

Michihiro Shintani, Kyoto Institute of Technology

Senling Wang, Ehime University

Jiun-Lang Huang, National Taiwan University

John CARULLI, GLOBALFOUNDRIES

Hiroyuki Yotsuyanagi, Tokushima University

Jin-Fu Li, National Central University

Jerzy TYSZER, Poznan University of Technology

Mango CHAO, National Chiao Tung University

Ching-Hwa CHENG, Feng-Chia University

Stephan EGGERSGLÜß, Siemens EDA

Tong-Yu Hsieh, EE Dept., National Sun Yat-sen University

Anne GATTIKER, IBM

Shi-Yu Huang, National Tsing Hua University, Taiwan

Kohei Miyase, Kyushu Instutute of Technology

Dimitris GIZOPOULOS, University of Athens

Sybille HELLEBRANT, University of Paderborn

ErikJan Marinissen, imec

Yousuke Miyake, PRIVATECH inc.

Chih-Tsun HUANG, National Tsing Hua University

Masahiro Ishida, ADVANTEST Corporation

Tsuyoshi IWAGAKI, Hiroshima City University

Tomoo INOUE, Hiroshima City University

Shuichi KAMEYAMA, Ehime University

Haruhiko KANEKO, Tokyo Institute of Technology

Saqib KHURSHEED, University of Liverpool

Haruo KOBAYASHI, Gunma University

Soumya MITTAL, Qualcomm

Shu-Min LI, National Sun YatSen University

Zizhen Liu, Chinese Academy of Sciences

Hiroshi Takahashi, Ehime Univ.

Jing-Jia LIOU, National Tsing Hua University

Dimitris NIKOLOS, University of Patras

Alex ORAILOGLU, University of California San Diego

Rubin PAREKHJI, Texas Instruments (Bangalore)

V PRASANTH, Texas Instruments

Hans Kerkhoff, University of Twente

MatteoSonza REORDA, Politecnico di Torino

Daniel TILLE, Infineon Technologies AG

Lin Ding, Hunan University

Zhenyu Wang, Hunan University

Hailong Yao, University of Science and Technology Beijing

Yanan Sun, Shanghai Jiao Tong University

Tianming Ni, Anhui Polytechnic University

Gang Li, Wenzhou University

Yaohua Wang, National University of Defense Technology

Zhiting Lin, Anhui University

Pengfei Qiu, Beijing University Of Posts and Telecommunications

Xueyan Wang, Beihang University

Wenfa Zhan, Anqing Normal University

Peng Liu, Guangdong University of Technology

Zhekang Dong, Hangzhou Dianzi University

Hao Sun, Southeast Univetsity

Jun Han, Fudan University

Ziyu Guo, Fudan University

Haoting Shen, Zhejiang University

Xiaohang Wang, Zhejiang University

Kun Yang, Zhejiang University

Na Bai, Anhui University

Zhe Liu, National University of Defense Technology

Xin Chen, Nanjing University of Aeronautics and Astronautics

Fan Yang, Fudan University

Wang KANG, Beihang University

Zhengfeng Huang, Hefei University of Technology

Aijiao Cui, Harbin Institute of technology(Shenzhen)

Zhikuang Cai, Nanjing University of Posts and Telecommunications

Zhangqing He, Hubei Universiy of Technology

Donglong Chen, BNU-HKBU United International College

Sheng Ma, National University of Defense Technology

Maliang Liu, Xidian University/ Hainan University

Sying-Jyan WANG, National Chung Hsing University

Dong XIANG, Tsinghua University

CharlesH.-P. WEN, National Chiao Tung University

Masayoshi YOSHIMURA, Kyoto Sangyo University

Tsung-Chu HUANG, National Changhua University of Education

Yu Huang, Hisilicon

Hans Manhaeve, Ridgetop Europe

Hans Tsai, Siemens EDA

Krishnendu Chakrabarty, Duke University

Ramesh Karri, Polytechnic Institute of NYU

Vivek Chickermane, Cadence Design Systems

Jingru Sun, Hunan University

Kuncai Zhong, Hunan University

Zhaojun Lu, Huazhong University of Science and Technology

Jinhua Cui, Hunan University

He Li, Southeast Univetsity

Qinghui Hong, Hunan University

Yongfu Li, Shanghai Jiao Tong University