Program Committee
Jiliang Zhang, Hunan University
Aibin Yan, Hefei University of Technology
Stefan Holst, Kyushu Institute of Technology
Michiko Inoue, Nara Institute of Science and Technology
Hao-Chiao Hong, National Yang Ming Chiao Tung University
Xiaoqing Wen, Kyushu Institute of Technology
Hideyuki Ichihara, Hiroshima City University
Michihiro Shintani, Kyoto Institute of Technology
Senling Wang, Ehime University
Jiun-Lang Huang, National Taiwan University
John CARULLI, GLOBALFOUNDRIES
Hiroyuki Yotsuyanagi, Tokushima University
Jin-Fu Li, National Central University
Jerzy TYSZER, Poznan University of Technology
Mango CHAO, National Chiao Tung University
Ching-Hwa CHENG, Feng-Chia University
Stephan EGGERSGLÜß, Siemens EDA
Tong-Yu Hsieh, EE Dept., National Sun Yat-sen University
Anne GATTIKER, IBM
Shi-Yu Huang, National Tsing Hua University, Taiwan
Kohei Miyase, Kyushu Instutute of Technology
Dimitris GIZOPOULOS, University of Athens
Sybille HELLEBRANT, University of Paderborn
ErikJan Marinissen, imec
Yousuke Miyake, PRIVATECH inc.
Chih-Tsun HUANG, National Tsing Hua University
Masahiro Ishida, ADVANTEST Corporation
Tsuyoshi IWAGAKI, Hiroshima City University
Tomoo INOUE, Hiroshima City University
Shuichi KAMEYAMA, Ehime University
Haruhiko KANEKO, Tokyo Institute of Technology
Saqib KHURSHEED, University of Liverpool
Haruo KOBAYASHI, Gunma University
Soumya MITTAL, Qualcomm
Shu-Min LI, National Sun YatSen University
Zizhen Liu, Chinese Academy of Sciences
Hiroshi Takahashi, Ehime Univ.
Jing-Jia LIOU, National Tsing Hua University
Dimitris NIKOLOS, University of Patras
Alex ORAILOGLU, University of California San Diego
Rubin PAREKHJI, Texas Instruments (Bangalore)
V PRASANTH, Texas Instruments
Hans Kerkhoff, University of Twente
MatteoSonza REORDA, Politecnico di Torino
Daniel TILLE, Infineon Technologies AG
Lin Ding, Hunan University
Zhenyu Wang, Hunan University
Hailong Yao, University of Science and Technology Beijing
Yanan Sun, Shanghai Jiao Tong University
Tianming Ni, Anhui Polytechnic University
Gang Li, Wenzhou University
Yaohua Wang, National University of Defense Technology
Zhiting Lin, Anhui University
Pengfei Qiu, Beijing University Of Posts and Telecommunications
Xueyan Wang, Beihang University
Wenfa Zhan, Anqing Normal University
Peng Liu, Guangdong University of Technology
Zhekang Dong, Hangzhou Dianzi University
Hao Sun, Southeast Univetsity
Jun Han, Fudan University
Ziyu Guo, Fudan University
Haoting Shen, Zhejiang University
Xiaohang Wang, Zhejiang University
Kun Yang, Zhejiang University
Na Bai, Anhui University
Zhe Liu, National University of Defense Technology
Xin Chen, Nanjing University of Aeronautics and Astronautics
Fan Yang, Fudan University
Wang KANG, Beihang University
Zhengfeng Huang, Hefei University of Technology
Aijiao Cui, Harbin Institute of technology(Shenzhen)
Zhikuang Cai, Nanjing University of Posts and Telecommunications
Zhangqing He, Hubei Universiy of Technology
Donglong Chen, BNU-HKBU United International College
Sheng Ma, National University of Defense Technology
Maliang Liu, Xidian University/ Hainan University
Sying-Jyan WANG, National Chung Hsing University
Dong XIANG, Tsinghua University
CharlesH.-P. WEN, National Chiao Tung University
Masayoshi YOSHIMURA, Kyoto Sangyo University
Tsung-Chu HUANG, National Changhua University of Education
Yu Huang, Hisilicon
Hans Manhaeve, Ridgetop Europe
Hans Tsai, Siemens EDA
Krishnendu Chakrabarty, Duke University
Ramesh Karri, Polytechnic Institute of NYU
Vivek Chickermane, Cadence Design Systems
Jingru Sun, Hunan University
Kuncai Zhong, Hunan University
Zhaojun Lu, Huazhong University of Science and Technology
Jinhua Cui, Hunan University
He Li, Southeast Univetsity
Qinghui Hong, Hunan University
Yongfu Li, Shanghai Jiao Tong University
Contact Us
Contacts: Jiliang Zhang, TPC Chair
E-mail: zhangjiliang@hnu.edu.cn
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